After long-awaiting the release of the new NVIDIA® Jetson Xavier™ NX module, production units are now available for purchase. Similar to the Jetson Nano™, the new Jetson Xavier™ NX module is sold without an integrated thermal transfer plate. Now that you’re ready to begin, what cooling option is right for your Jetson Xavier™ NX project?

Selecting the appropriate thermal product for your project will depend on whether you require heat dissipation in other areas, and how much air flow is anticipated within the final product.

The performance capabilities of the compact Jetson Xavier™ NX make it perfect for high-performance AI systems, delivering an unprecedented 14 TOPS in 10 W and 21 TOPS in 15W. In order to ensure optimal module performance, you’ll have to remove the majority of that heat. Since Jetson Xavier™ NX will predominately be used in small form factor products, designing for thermal can create significant challenges.

A critical pathway for system design is to understand how air is flowing through the system. Understanding cooling and venting options is a great start, and our experience has shown that engaging with a thermal engineer can be hugely helpful for complex projects.

Our expertise within the Jetson™ platform has allowed us to develop verified thermal solutions for the Jetson Xavier™ NX module that are flexible for any use-case you may have.

Active Heat Sink
The Active Heat Sink is best used within closed box systems that have no natural air flow. Any heat produced by the module during operation is dissipated through fins and expelled by a fan.

Passive Heat Sink
If your project is anticipated to receive sufficient air flow, a Passive Heat Sink option is likely appropriate. Any heat produced by the module is dissipated through convection with the help of optimized fin placement.

Thermal Transfer Plate
If your product has enough material to properly dissipate heat from the entire system and you’ve arranged alternative heatsinking, a heat plate for the module could be a great option. The thermal transfer plate aids in cooling while providing damage protection for the module.

To confirm price and availability of Jetson Xavier™ NX thermal solutions, please contact

TIP: You may notice a small difference when comparing the above listed thermal solutions to the active heat sink supplied with the NVIDIA Jetson Xavier™ NX Development Kit. The development kit’s active heat sink uses a spring-loaded backing bracket to attach to the module. Connect Tech’s heat sink options use gap pads. Both solutions are effective in aiding heat dissipation from the module.

To ensure space requirements are met, 3D models of the standard thermal solutions are available. Connect Tech also offers mechanical and thermal solutions that can be custom tailored to your project. Contact for more information.