NVIDIA® Jetson AGX Orin™ Industrial Module / 900-13701-0080-000

  • 2048-core NVIDIA Ampere architecture GPU with 64 tensor cores
  • 2x NVDLA v2.0
  • 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
  • 64GB 256-bit LPDDR5 (+ ECC)
  • 64GB eMMC 5.1
  • PVA v2.0

Part #: 900-13701-0080-000 Category: Tags: , , , ,

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The NVIDIA® Jetson AGX Orin™ Industrial module delivers up to 248 TOPs of AI performance for embedded industrial applications with power configurable between 15W and 75W. It’s form-factor and pin-compatible with Jetson AGX Orin, and gives you more than 8X the performance of Jetson AGX Xavier Industrial.

This system-on-module supports multiple concurrent AI application pipelines with an NVIDIA Ampere architecture GPU, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. It comes with extended temperature range, operating lifetime, and shock and vibration specifications, as well as support for Error Correction Code (ECC) memory, making it ideal for industrial grade AI products. The module also includes security features such as hardware root of trust, secure boot, hardware accelerated cryptography, support for encrypted storage and memory, and other security features to protect your deployments.


AI Performance

248 TOPS


2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores


12-core Arm® Cortex®-A78AE v8.2 64-bit CPU

DL Accelerator


Vision Accelerator

1x PVA v2


64GB 256-bit LPDDR5 (+ ECC) 204.8GB/s


64GB eMMC 5.1

Video Encode

1x 4K60 (H.265) 3x 4K30 (H.265) 7x 1080p60 (H.265) 15x 1080p30 (H.265)

Video Decode

1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 23x 1080p30 (H.265)


Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)

PCI Express

Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint)


3x USB 3.2 Gen2 (10 Gbps) 4x USB 2.0


1x GbE 1x 10GbE


1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1


4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs

Processor Thermal Design Power (W)



100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate

Integrates with

Forge Carrier – AGX201

Ordering Information

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Part Number Description
900-13701-0080-000 NVIDIA® Jetson AGX Orin™ Industrial Module

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