-
Spec Sheet
The Xtreme/FP board uses the small module form factor of the FeaturePak specification. It is designed to add four high speed serial ports to your FeaturePak compatible baseboard or single board computer. It also allows you to use 16 bits of custom configurable digital I/O to expand functionality, control and communicate to different devices. Xtreme/FP can be used for a wide range of embedded applications. -
Spec Sheet
Connect Tech’s PCI Express to FeaturePak Adapter board allows users to install a FeaturePak module into any PCI Express system slot. This adapter allows for easy development, debugging, and prototyping directly on the adapter and it brings out all of the FeaturePak IO signals to separate headers and connectors, as well as giving the user access to all of the critical additional FeaturePak signals. -
Spec Sheet
This system-on-module supports multiple concurrent AI application pipelines with the NVIDIA Ampere GPU architecture, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. Now you can develop solutions using your largest and most complex AI models to solve problems such as natural language understanding, 3D perception, and multi-sensor fusion. Jetson runs the NVIDIA AI software stack, and use-case specific application frameworks are available, including Isaac™ for robotics, DeepStream for vision AI, and Riva for conversational AI. You can save significant time with NVIDIA Omniverse Replicator for synthetic data generation (SDG), and by using NVIDIA TAO toolkit to fine-tune pretrained AI models from the NGC™ catalog. -
Spec Sheet
The NVIDIA Jetson AGX Orin 64GB module delivers up to 275 TOPS of AI performance with power configurable between 15W and 60W. This gives you more than 8X the performance of Jetson AGX Xavier in the same compact form-factor for robotics and other autonomous machine use cases. This system-on-module supports multiple concurrent AI application pipelines with the NVIDIA Ampere GPU architecture, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. Now you can develop solutions using your largest and most complex AI models to solve problems such as natural language understanding, 3D perception, and multi-sensor fusion. -
Spec Sheet
The NVIDIA® Jetson AGX Orin™ Industrial module delivers up to 248 TOPs of AI performance for embedded industrial applications with power configurable between 15W and 75W. It’s form-factor and pin-compatible with Jetson AGX Orin, and gives you more than 8X the performance of Jetson AGX Xavier Industrial. This system-on-module supports multiple concurrent AI application pipelines with an NVIDIA Ampere architecture GPU, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. It comes with extended temperature range, operating lifetime, and shock and vibration specifications, as well as support for Error Correction Code (ECC) memory, making it ideal for industrial grade AI products. The module also includes security features such as hardware root of trust, secure boot, hardware accelerated cryptography, support for encrypted storage and memory, and other security features to protect your deployments.
