NVIDIA® Jetson AGX Orin™ Passive Heat Sink

  • Designed to fit the NVIDIA® Jetson AGX Orin™ and AGX Orin™ Industrial Modules
  • Dissipates the heat produced by the module through convection
  • Dimensions: 100mm x 87mm x 33.5mm/3.93” x 3.43” x 1.32”

More Information

The NVIDIA® Jetson™ AGX Orin™ is the world’s first AI computer for autonomous machines. NVIDIA® Jetson™ AGX Orin™ has an impressive 2048-core Ampere GPU and 64 Tensor cores with discreet dual Deep Learning Accelerator (DLA) NVDLA engines. The platform offers an incredible jump over AGX Xavier™. Connect Tech is proud to provide small form factor carriers and embedded system solutions for AGX Orin™. To assist in your selection of our solutions, we have included accessories to match our products. Readily available thermal options get you up and running fast.

Specifications

Dimensions

100mm x 87mm x 33.5mm/3.93” x 3.43” x 1.32”

Weight

294.8g/0.65lb

Fan Connector

4-Pin Molex 51021-0400

Mating Header

4-pin Molex 53261-0471

Thermal Resistance

0.28 °C/W

Mounting Fasteners

M3.0X0.5 PPHMS, 30mm long, S.S

Mounting Fastener Torque Rating

5.2 in-ib

Ordering Information

Main Products
Part Number Description
XHG320 NVIDIA® Jetson AGX Orin™ Passive Heat Sink

Custom Design

Looking for a customized NVIDIA® AGX Orin™ Product? Click here to tell us what you need.

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