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The Lepton FPD-Link III Carrier Board is designed for the NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano modules for seamless integration and enhanced functionality. Lepton features dual GbE ports and abundant USB connectivity with four USB 3.0 ports. With four FPD-Link III camera inputs, NVMe storage expansion, and versatile M.2 slots, Lepton offers flexibility for diverse applications.
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The Hadron-DM Carrier Board for Jetson Orin™ Nano is an ultra small, rugged and feature rich carrier for AI Computing at the Edge. Just slightly larger than the Jetson™ SODIMM module, Hadron is ideal for vision applications, inference, and unmanned payloads. Hadron-DM features Dual MIPI CSI-2 connectors for greater versatility. Since the Hadron-DM carrier board is compatible with the Jetson Orin™ NX, and Jetson Orin™ Nano modules, users can transition between modules depending on their AI processing requirements.
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The Hadron-DM Carrier Board for Jetson Orin™ NX is an ultra small, rugged and feature rich carrier for AI Computing at the Edge. Just slightly larger than the Jetson™ SODIMM module, Hadron is ideal for vision applications, inference, and unmanned payloads. Hadron-DM features Dual MIPI CSI-2 connectors for greater versatility. Since the Hadron-DM carrier board is compatible with the Jetson Orin™ NX, and Jetson Orin™ Nano modules, users can transition between modules depending on their AI processing requirements.
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Boson-22 for Jetson Orin™ Nano is an AI vision powerhouse, integrating up to four MIPI cameras within an extremely small footprint. Boson-22 for Jetson Orin™ Nano maximizes sensor inputs and storage solutions for high-end vision applications. Compatible with multiple sensor modules and equipped with PC style connectors, Boson-22 will accelerate development of applications wishing to utilize multiple cameras on the Jetson platform.
Boson-22 Integration Options
Direct camera integration to the carrier board eliminates the need for an adapter board and decreases the overall hardware stack height. Customers looking for a full stack option can choose to integrate Boson with their NVIDIA module of choice, available heat sinks, as well as other connectivity options.Heat Sink Options
- Jetson Orin NX Thermal Transfer Plate
- Jetson Orin NX Passive Heat Sink
- Jetson Orin NX Active Heat Sink
Additional Feature Options
- WiFi/Bluetooth additions (through 2230 E-Key Expansion)
- NVMe storage (through M.2 M-Key (2280) NVMe PCIe x4)
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The Hadron GMSL Carrier Board for Orin™ NX and Orin™ Nano stands out as an ultra-compact, robust, and feature-rich solution, boasting dual GMSL2 camera inputs. It ensures high-speed, dependable data communication, crucial for autonomous applications. Just slightly larger than the Jetson™ SODIMM module, Hadron is perfect for GMSL vision applications, inference processing, and unmanned payloads, making it an ideal choice for AI computing at the Edge. Hadron’s design accepts a wide input voltage range, provides a comprehensive I/O set, with locking I/O connectors optimized for rugged environments.
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The NVIDIA® Jetson Orin™ Nano production module does not include a thermal transfer plate. Connect Tech provides a thermal transfer plate that users can integrate into a custom chassis or to other interface material for further cooling of the Jetson Orin™ Nano production module. Readily available thermal options get you up and running fast.
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NVIDIA® Jetson Orin™ Nano delivers supercomputer performance in a tiny footprint. Since this module does not come standard with any integrated thermal solutions, all projects will require additional thermal consideration. To help get your project off the ground, we’ve developed a selection of readily available thermal options to get you up and running in record time.
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The Hadron Carrier Board for Jetson Orin™ NX is an ultra small, rugged and feature rich carrier for AI Computing at the Edge. Just slightly larger than the Jetson™ SODIMM module, Hadron is ideal for vision applications, inference, and unmanned payloads. Since the Hadron carrier board is compatible with the Jetson Orin™ NX, Orin™ Nano, Xavier™ NX, and TX2™ NX modules, users can transition between modules depending on their AI processing requirements. Hadron’s design includes a wide input voltage, rich I/O set as well as locking IO connectors optimized for rugged environments.
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Boson is an AI vision powerhouse, integrating up to four MIPI cameras within an extremely small footprint. Boson maximizes sensor inputs and storage solutions for high-end vision applications. This product offering provides customers with a plug and play vision solution that accelerates application development time. Compatible with NVIDIA® Jetson Orin™ Nano, and Orin™ NX, users can seamlessly transition between modules should their processing needs change. Connectors allow users to directly connect up to 4x 2-lane or 2x 4-lane MIPI CSI-2 cameras.
Boson Integration Options
Direct camera integration to the carrier board eliminates the need for an adapter board and decreases the overall hardware stack height. Customers looking for a full stack option can choose to integrate Boson for FRAMOS with their NVIDIA module of choice, available heat sinks, as well as other connectivity options.Heat Sink Options
- Jetson Xavier NX Thermal Transfer Plate
- Jetson Xavier NX Passive Heat Sink
- Jetson Xavier NX Active Heat Sink (2 options available)
Additional Feature Options
- WiFi/Bluetooth additions (through 2230 E-Key Expansion)
- Storage via microSD card
- NVMe storage (through M.2 M-Key (2280) NVMe PCIe x4)
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The Hadron Carrier Board for Jetson Orin™ Nano is an ultra small, rugged and feature rich carrier for AI Computing at the Edge. Just slightly larger than the Jetson™ SODIMM module, Hadron is ideal for vision applications, inference, and unmanned payloads. Since the Hadron carrier board is compatible with the Jetson Orin™ NX, Orin™ Nano, Xavier™ NX, and TX2™ NX modules, users can transition between modules depending on their AI processing requirements. Hadron’s design includes a wide input voltage, rich I/O set as well as locking IO connectors optimized for rugged environments.
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The Lepton FPD-Link III Carrier Board is designed for the NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano modules for seamless integration and enhanced functionality. Lepton features dual GbE ports and abundant USB connectivity with four USB 3.0 ports. With four FPD-Link III camera inputs, NVMe storage expansion, and versatile M.2 slots, Lepton offers flexibility for diverse applications.
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The Hadron GMSL Carrier Board for Orin™ Nano and Orin™ NX stands out as an ultra-compact, robust, and feature-rich solution, boasting dual GMSL2 camera inputs. It ensures high-speed, dependable data communication, crucial for autonomous applications. Just slightly larger than the Jetson™ SODIMM module, Hadron is perfect for GMSL vision applications, inference processing, and unmanned payloads, making it an ideal choice for AI computing at the Edge. Hadron’s design accepts a wide input voltage range, provides a comprehensive I/O set, with locking I/O connectors optimized for rugged environments.