Sentry-X2 MIL-Rugged System Powered by NVIDIA® Jetson AGX Orin™ Industrial

  • 4x 3G-SDI/HD-SDI/SDI Inputs**
  • 2x 3G-SDI/HD-SDI/SDI Outputs**
  • Up to 4TB NVMe Storage
  • Up to 3x Ethernet Ports: 10GbE, 2.5GbE, 1GbE*
  • Tested to IP67, MIL-STD-810H

More Information

Sentry-X2 is a MIL-Rugged system, powered by the NVIDIA® Jetson AGX Orin™ Industrial module.

Designed for mission critical applications in harsh environments, the Sentry-X2 is a MIL-SPEC certified AI system for computing at the tactical edge. The NVIDIA® Jetson AGX Orin™ Industrial is a 2048-core GPU capable of 248 TOPS, ideal for advanced AI and machine learning applications. The Sentry-X2 includes 4x 3G-SDI/HD-SDI/SDI inputs** and 2x 3G-SDI/HD-SDI/SDI outputs**, suitable for complex vision systems, as well as 10Gb, 2.5Gb, and 1Gb* Ethernet, dual USB 3.2 ports, and a wide array of I/O options.

Tested to MIL-STD specifications for shock and vibration and utilizing IP67 rated D38999 connectors for data integrity, Sentry-X2 is designed to meet the strict requirements of military, aerospace, and heavy industrial applications.

Specifications

Module Compatibility

Pre-integrated with NVIDIA® Jetson AGX Orin™ Industrial (248 TOPS)

GPU

2048-core NVIDIA® Ampere architecture GPU with 64 Tensor Cores

CPU

12-core Arm® Cortex®-A78AE v8.2 64-bit CPU – 3MB L2 + 6MB L3

Memory

64GB 256-bit LPDDR5 (+ ECC)
204.8GB/s

Dimensions

200mm x 180mm x 125mm (7.87" x 7.09" x 4.92")

Video Output

1x DisplayPort 1.4 Output 4K @ 60HZ

Networking

1x 10GBASE-T Ethernet (10GbE)
1x 2.5GBASE-T Ethernet (2.5GbE)
*1x 1000BASE-T Ethernet (1GbE) (ESG630 only)

**Optional SDI Camera Input

4x 3G-SDI/HD-SDI/SDI Inputs
2x 3G-SDI/HD-SDI/SDI Outputs

USB

2x USB 3.2 Ports (10Gbps Capable)

Storage

1x M.2 M Key (Up to 4TB NVMe)

Wireless Expansion

1x M.2 E Key Wi-Fi/BT (optional)

Trusted Platform Module (TPM)

SLB9670 TPM2.0 Chipset
Hardware TPM Implementation

Input Power / Misc Power Details

MIL-STD-704F Input Power
+28V Nominal Operating Voltage
(+16V to +50V Range as specified by MIL-STD-704F)
Designed to EMI/EMC as per MIL-STD-461F/G

GPIO / Serial Interfaces

10x 3v3 GPIO (2x PWM capable)
2x 3.3V, 1A Source pin
2x UART (RS232/422/485 configurable)
1x 3.3V I2C
1x 3.3V SPI
2x 3.3V UART
2x Non-Isolated CAN 2.0b

Operating Temperature

-40°C to +70°C (-40°F to +158°F)

Weight

Min 3.0 KG, Max 3.5 KG (Based on Configuration)

MIL Specifications

Environmental: MIL-STD-810H, DO-160H
EMC/EMI: MIL-STD-461G, MIL-HDBK-704F, MIL-HDBK-831

Optional MIL-STD 1553B

1x MIL-STD 1553

Warranty and Support

1 Year Warranty and Free Technical Support

Downloads

NVIDIA Jetson AGX Orin

Package InfoBoard Support PackageRelease NotesDate Last Updated
JetPack 6.2.1 - L4T r36.4.4AGX Orin L4T r36.4.4 BSPAGX Orin L4T r36.4.4 Release Notes05-May-26
JetPack 6.2.1 - L4T r36.4.4 (RealTime OS)AGX Orin L4T r36.4.4 BSP (RealTime OS)AGX Orin L4T r36.4.4 Release Notes (RTOS)22-Dec-25
JetPack 6.2 - L4T r36.4.3AGX Orin L4T r36.4.3 BSPAGX Orin L4T r36.4.3 Release Notes18-Jul-25
JetPack 6.1 - L4T r36.4.0AGX Orin L4T r36.4.0 BSPAGX Orin L4T r36.4.0 Release Notes13-Feb-25
JetPack 6.1 - L4T r36.4.0 (RealTime OS)AGX Orin L4T r36.4.0 BSP (RealTime OS)AGX Orin L4T r36.4.0 Release Notes (RTOS) 04-Dec-24
JetPack 6 - L4T r36.3.0AGX Orin L4T r36.3.0 BSPAGX Orin L4T r36.3.0 Release Notes07-Oct-24
JetPack 5.1.5 - L4T r35.6.2AGX Orin L4T r35.6.2 BSPAGX Orin L4T r35.6.2 Release Notes16-Sept-25
JetPack 5.1.4 - L4T r35.6.0AGX Orin L4T r35.6.0 BSPAGX Orin L4T r35.6.0 Release Notes29-May-25
JetPack 5.1.3 - L4T r35.5.0AGX Orin L4T r35.5.0 BSPAGX Orin L4T r35.5.0 Release Notes23-Jun-25
JetPack 5.1.2 - L4T r35.4.1AGX Orin L4T r35.4.1 BSPAGX Orin L4T r35.4.1 Release Notes14-Aug-24
JetPack 5.1.1 - L4T r35.3.1AGX Orin L4T r35.3.1 BSPAGX Orin L4T r35.3.1 Release Notes05-Sept-23
JetPack 5.1.0 - L4T r35.2.1AGX Orin L4T r35.2.1 BSPAGX Orin L4T r35.2.1 Release Notes22-Jun-23
JetPack 5.0.2 - L4T r35.1.0AGX Orin L4T r35.1.0 BSPAGX Orin L4T r35.1.0 Release Notes05-Jan-23

Ordering Information

Integrated Assemblies
Part Number Description
ESG630-002    Sentry-X2 Embedded System integrated with NVIDIA® Jetson AGX Orin™ Industrial Module with Passive Cooling, 2 TB NVMe, 4x 3G-SDI inputs
ESG630-011     Sentry-X2 Embedded System integrated with NVIDIA® Jetson AGX Orin™ Industrial Module with Passive Cooling, 2 TB NVMe, 4x 3G-SDI inputs, MIL-STD-1553
ESG633-001 Sentry-X2 Embedded System integrated with NVIDIA® Jetson AGX Orin™ Industrial Module with Passive Cooling, 2 TB NVMe
Cables/Accessories
Part Number Description
CBG738 Sentry-X2 MIL-38999 Power Cable Flying Lead
CBG745 Sentry-X2 1 Meter MIL-38999 Meritec Cable
ADG121 Sentry-X2 (ESG633) Meritec MIL-38999 Development Breakout PCB
ADG120 Sentry-X2 (ESG630) Meritec MIL-38999 Development Breakout PCB
CKG070 Sentry-X2 (ESG633) Starter Kit:
• 1x CBG738 MIL-38999 Power Cable Flying Lead
• 1x CBG745 1 Meter MIL-38999 Meritec Cable
• 1x ADG121 Sentry-X2 (ESG633) Meritec MIL-38999 Development Breakout PCB
CKG071 Sentry-X2 (ESG630) Starter Kit:
• 1x CBG738 MIL-38999 Power Cable Flying Lead
• 1x CBG745 1 Meter MIL-38999 Meritec Cable
• 1x ADG120 Sentry-X2 (ESG630) Meritec MIL-38999 Development Breakout PCB
MSG125 Sentry-X2 Development AC/DC Power Supply with MIL-38999 Adapter Cable
MSG093 Sentry-X2 Wi-Fi/BT Development Antenna

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